| 摘要 |
PURPOSE:To reduce any foreign matters adhering to a wafer by a method wherein a foreign matter peeled off or fallen away from target, device ceiling and sheltering ring etc. is sheltered by a foreign matter sheltering body. CONSTITUTION:A foreign matter sheltering body 14 made of aluminum, stainless and molybudenum etc. is fixed to a device ceiling 6. This foreign matter sheltering body 14 with L type section composed of a ring structure provided with a foreign matter sheltering part 15 protruding toward inner peripheral side is fixed on the peripheral part of a dent 7 to shelter a wafer 1 from a dropping foreign matter 16 as well as to prevent the foreign matter from adhering to the wafer 1. Besides, the sheltering length (l) of foreign matter sheltering part 15 for the peripheral part of a target 4 may be made almost equivalent to 1/2 of the distance (L) from the target 4 to the foreign matter sheltering part 15 to make the sheltering most effective. |
