发明名称 HEAT-RELEASING PLATE FOR THERMAL HEAD
摘要 PURPOSE:To enable to record with uniform and high quality, by a method wherein a surface of a heat-releasing member on which a ceramic substrate is to be placed is provided with a groove at a back part of a heating resistor array, and a thermally conductive filler is packed into the groove. CONSTITUTION:The heat-releasing plate is produced by providing the heat- releasing member 3 with the groove 6, and filling the groove 6 with a heat- releasing grease 4. The member 3 is a thick aluminum plate slightly larger than the ceramic substrate 2 of a thermal head 1. The groove 6 is an elongate recess with a rectangular cross section, and is provided in the surface of the member 3 on which the substrate 2 is placed, at the back part of the heating resistor array 5. The grease 4 is a filler having a high viscosity and a high thermal conductivity, but the thermal conductivity thereof is poor as compared with that of the member 3. The grease 4 not only fill up the groove 6 but also fill up the gap between the member 3 and the substrate 2, and adheres the substrate 2 to the member 3. Accordingly, temperature differences in the array 5 are reduced, and the scarcely affect the recording density.
申请公布号 JPS61130060(A) 申请公布日期 1986.06.17
申请号 JP19840253371 申请日期 1984.11.29
申请人 ROHM CO LTD 发明人 KASHIWAJIMA TADASHI
分类号 B41J2/335 主分类号 B41J2/335
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