| 摘要 |
<p>A microcircuit package utilizes a two-part bimetal lead frame (10) to achieve high-integrity matched hermetic seals for withstanding corrosion including salt spray through the utilization of a two-part lead comprising in one embodiment a "Kovar" portion (12) which passes from the interior of the package through the glass seal (30) to within a predetermined short distance of the package exterior. At this point the "Kovar" lead portion (12) is mechanically and electrically connected to another metal lead frame portion (14) which passes the rest of the way through the glass seal (30) and extends from the microcircuit package, with the exteriorly extending lead frame portion (14) being selected for either corrosion resistance or improved thermal or electrical characteristics, or both.</p> |
