发明名称 DEVICE FOR DIPPING ELECTRONIC PARTS INTO SOLDER
摘要 PURPOSE:To improve remarkably working efficiency by dipping automatically and continuously both ends of electronic parts into solder with one unit. CONSTITUTION:A titled device contains flux tanks 18, 18' and molten solder tanks 17, 17' which are alternately disposed and two sets of conveying bases 20, 20' which are disposed along the arranging direction of the tanks. Said bases are disposed in the upper part of the tanks. The device is also constituted of holders 34, 34' which hold electronic parts, mechanisms 21-32 for holding the holders in such a way as to make horizontal movement including stoppage together with the tanks and vertical movement in the stage of stoppage as well as turning mechanisms 33, 38-43 provided between the holders and the supporting mechanisms to direct the holders respectively in the opposite directions around the position where the holders face the tanks at the beginning and end of the horizontal movement.
申请公布号 JPS60199565(A) 申请公布日期 1985.10.09
申请号 JP19840055993 申请日期 1984.03.26
申请人 NITSUTOKU KAIHATSU CENTER:KK 发明人 HASHIMOTO TAKASHI;SUZUKI TSUTOMU;OZAKI SHINJI
分类号 H01F27/29;B23K1/08;B23K101/38;H05K3/34 主分类号 H01F27/29
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