| 摘要 |
<p>Evaporative cooling particularly useful for semiconductor integrated circuits is more efficient when a liquid is completely evaporated at the heat radiating surface. The liquid is converted to droplets and mixed with the gas at the heat radiating surface.</p><p>In the figure, heat from chip 2 is transferred to heat exchange member 3 comprising heat sump 4 and porous sintered member 5. Water, air and exhaust products are delivered and removed by manifold 11 and conduit member 12. Water is delivered through the space between elements 13, .14, air through the space between elements 14, 15 and the exhaust products removed through space 18.</p> |
