| 摘要 |
PURPOSE:To carry in and carry out a wafer efficiently by mounting two wafer chucks for carrying in and carrying out the wafer and simultaneously executing the wafer gripping operation of one wafer chuck and the wafer releasing operation of the other wafer chuck. CONSTITUTION:The outer circumference of a wafer horizontally forwarded into a spare chamber 9 by a belt device 11b from a wafer supply chamber 11a is held by gripping pawls 19a for a wafer chuck 18a. A wafer carrying arm 17 is turned up to the upper section of a turntable 10 in a process chamber 8 through an opening section for a sluice valve 16, and the wafer being gripped is placed on the turntable 10. A wafer previously treated on the table 10 is gripped simultaneously by pawls 19b for the other wafer chuck 18b, and returned into the spare chamber 9 through a return revolution, and the wafer previously treated is placed on a wafer take-in belt device 12b. |
