Selective electroplating apparatus having a cleaning device

摘要

A selective electroplating apparatus including a masking member and a back-up plate for supporting a metal strip of lead frame therebetween. Electrolyte or electroplating liquid is sprayed through an aperture of the masking member onto a selective portion of the strip. Electric voltage is applied between an anode and the cathodically charged lead frame strip to form an electroplated layer on the selective portion of the strip. The masking member and the back-up plate are brought toward each other to support and contact the strip therebetween and away from each other to define a clearance therebetween, in each cycle of the electroplating process. Cleaning liquid is sprayed into the clearance defined between the masking member and the back-up plate during or after they are brought away from each other.