| 摘要 |
<p>PURPOSE:To enable treatment at low temperatures in a neutral atmosphere by a method wherein a film of a metal of the group VIa is formed at the part of soldering on a ceramic substrate, and a film of a metal of the group VIII is formed thereon; then, an input-output electrical connection pin of solder is soldered thereon. CONSTITUTION:A chromium film 33 of 300Angstrom -1,000Angstrom thickness is formed on the surface of a multilayer ceramic substrate 31. A layer 34 of palladium a metal of the group VIII is successively formed from above the chromium film 33. The ceramic substrate having a metallic pad is placed on a plurality of the input-output electrical connection pins 36 made of kovar or 4.2 alloy to which an alloy 35 having a weight ratio of Au 80% and Sn 20% has been installed respectively to approx. 1-3mg, and is thus bonded on the layer of palladium a metal of the group VIII. The surface of the metallic pin 36 is coated with an Au coat layer 37 formed by plating and the like.</p> |
