| 摘要 |
<p>PURPOSE:To check to exert an influence such as a distortion, stress, etc. to an element when a diode array is cut into chips by a method wherein cutting edges are made to come in contact with the upper surface and the under surface of the chip cutout part of the array, both the cutting edges are pressed against the opposite directions, and pressure is applied to cut the cutout part. CONSTITUTION:An under cutting edge 13 is put under the chip cutput position from a semiconductor laser diode array 1, and an upper cutting edge 3 is put at the chip cutout position of the upper surface opposite to the cutting edge 13 perpendicularly in succession. Then pressure is applied to the edge 3 to perform cutting. According to this method, because the chip is cut perpendicularly, and stress and a distortion generated according to application of pressure are concentrated to the coming in contact part of the edge 13, exertion of an nfluence such as a distortion, etc. to a light emitting part can be checked.</p> |
