| 摘要 |
PURPOSE:To uniformize the thickness and the pattern dimensions of a resist film by arranging nozzle tips on a line containing the center and a part of the periphery of a wafer and dripping a developing solution onto the wafer simultaneously. CONSTITUTION:A plurality of nozzles 9 are fixed with a plate 10 with their tips arranged in the radial direction of a wafer. The space between two nozzles may be 5mm. or less. A vacuum chuck is rotated at about 500rpm so that a developing solution is dripped onto the wafer 6 for 1-2sec. According to this construction, the time required for the developing solution to be applied all over the wafer is uniformized, and the dripping operation is finished in a short period of time. Further, the thickness and the pattern dimensions of a resist film obtained after the development can be also uniformized. A similar effect can be obtained by a construction in which a conical plate 14 provided with small holes 17 for dispersing the developing solution is mounted within an umbrella-shaped nozzle 15 which is provided with a multiplicity of small holes 8 on the bottom face thereof. |
