| 摘要 |
<p>PURPOSE:To facilitate bonding of a semiconductor chip to the cases of various kinds by a method wherein bonding pads of the plural number of pieces connected electrically mutually are provided on the semiconductor chip, and only a part of the pads thereof is connected electrically to the case according to lead wires. CONSTITUTION:Bonding pads 9, 9', 10' of the plural number are formed on a semiconductor chip 6, while the pads 9, 9' out of the pads thereof are connected using respectively lead wires 8, 8' to wirings 7, 7' provided respectively to the outside peripheral part of the case. However the pad 10 is left idle without connecting to anywhere. The chips 6 are formed in the same shape like this, accommodated in a ceramic or plastic case, and only the necessary pads are connected to the wirings to simplify formation of an IC, etc.</p> |
