发明名称 SOLUTION FOR PRETREATING ALUMINUM SUBSTRATE BEFORE PLATING
摘要 PURPOSE:To improve the adhesive strength of an Al substrate to plating by using a pretreating soln. consisting of acidic sodium fluoride and an aqueous HCl soln. CONSTITUTION:A soln. for pretreating an Al substrate before plating is prepd. by adding acidic sodium fluoride to an aqueous HCl soln. in 0.003-15 concn. ratio of acidic sodium fluoride to HCl and by mixing and stirring them. An Al substrate is immersed in the pretreating soln. kept at 15-30 deg.C until bubbles are generated on the whole surface of the substrate.
申请公布号 JPS60197895(A) 申请公布日期 1985.10.07
申请号 JP19840052200 申请日期 1984.03.21
申请人 ASAHI KASEI KOGYO KK 发明人 MAKI YOSHIYUKI;KOYAMA RIYOUHEI
分类号 C25D5/44 主分类号 C25D5/44
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