发明名称 THICK-FILM CIRCUIT
摘要 <p>PURPOSE:To connect a pair of desired conductors in a superposing manner by a thick-film resistor without defective connection by concealing and coating the surface of a section adjoining to a pair of the conductors in a third conductor with an insulator. CONSTITUTION:Resistance paste mainly comprising ruthenium oxide as a thick- film resistor 51 connecting first layer conductors 22 and 23 in a superposing manner is printed. Resistance paste is baked at approximately 850 deg.C and changed into the thick-film resistor 51. The surface section of a first layer conductor 21 is concealed and coated with a lower layer insulator 31 by the oozing-out of resistance paste at a step when the resistor 51 is formed, and the first layer conductors 21 and 22 requiring no connection are not connected. Since end sections are buried by the lower layer insulator 31 having thickness in the same extent as the conductors 21, 22 between the first layer conductors 21 and 22, adhesive pdoperties to a surface to be printed of a printing mask on the printing of resistance paste can be improved, and the oozing-out of resistance paste is also reduced.</p>
申请公布号 JPS60196963(A) 申请公布日期 1985.10.05
申请号 JP19840052256 申请日期 1984.03.21
申请人 HITACHI SEISAKUSHO KK 发明人 ISOMAE HIROMI
分类号 H01C17/24;H01C17/06;H01L21/70;H01L27/01;H05K1/09;H05K1/16;H05K3/28;H05K3/46 主分类号 H01C17/24
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