| 摘要 |
The system includes a mother board (101) formed of a printed circuit (133) and heat sink (134) supports two electrical connectors (135,136) between which the substrate (106) is carried. Two circuits (131,141) of chip-carrier type are bonded conventionally to the underside of the substrate (106), and housed in recesses (151,152) in a heat radiator (142). An electrical connection circuit links the electronic components to the end connectors (135,136). Thermal contact is ensured by connections (144) between the radiator (142) and chip-carriers (131,141), as well as between the substrate (106) and radiator (142) in regions (153-155) which are not covered by the components. The radiator is screwed (145) firmly to the heat sink (134). The height of the radiator (142) in the regions which do not include the recesses (151,152) is substantially equal to the distance between the substrate (106) and heat sink. |
