发明名称 SOLDER ALLOY
摘要 PURPOSE:To provide a solder alloy which can be used while the alloy is rested in the atm and which is hardly oxidizable by incorporating a specific ratio of Sn, Ag and P into Pb. CONSTITUTION:A solder alloy is produced by compounding respective raw materials so as to contain 0.5-5.0wt% Sn, 0.5-5.0wt% Ag, 0.01-0.3wt% P and the balance Pb, melting the mixture in an electric furnace or the like, extruding the molten alloy from a casting ingot and finishing the extrudate to a desired shape including a wire, tape, etc. by working such as rolling. Since such solder alloy is hardly oxidizable, the labor for storage and pretreatment are not required.
申请公布号 JPS60196285(A) 申请公布日期 1985.10.04
申请号 JP19840052740 申请日期 1984.03.19
申请人 FURUKAWA DENKI KOGYO KK 发明人 KIKUCHI SUKEYUKI;SHIROYAMA KAISUKE;KOSUGI KEIZOU
分类号 B23K35/26 主分类号 B23K35/26
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