发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the mounting position accuracy of a chip and the reliability by providing a stationary member made of a shape memory alloy, and securing a substrate or a lead frame with a semiconductor chip, thereby reducing the machining cost. CONSTITUTION:A stationary member 2 is formed of a shape memory alloy which stores the shape to secure a semiconductor chip 6, and formed integrally with a tab 1, a tab lead 3, lead 4 and an outer frame 5. The shape for securing the chip 6 by the member 2 on the prescribed position on the upper surface of the tab 1 is stored by forming in the alloy at a temperature such as 50-100 deg.C. After the member 2 is placed with the chip 6 at the prescribed position on the upper surface of the tab 1, the member 2 made of the alloy is heat treated, for example, 100-150 deg.C. Thus, the portion stored at the member 2 is returned to the prescribed shape (bent) to hold the chip 6. Thus, the chip 6 can be secured to the tab 1.
申请公布号 JPS60195943(A) 申请公布日期 1985.10.04
申请号 JP19840050926 申请日期 1984.03.19
申请人 HITACHI SEISAKUSHO KK 发明人 IWATA YUTAKA;TSUBOSAKI KUNIHIRO
分类号 H01L21/52;H01L21/58;H01L23/495 主分类号 H01L21/52
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