SEMICONDUCTOR DEVICE

摘要

PURPOSE:To enhance the reliability by coating a resin having good bondability on both of a lead frame material and a package resin at least one of the resin- sealed surface of the back surface of a tab and the inner lead, thereby preventing a crack from occurring. CONSTITUTION:A lead frame on which a polyimide resin 10 is coated is used as a coating resin on the surface of an internal lead 9 except the back surface of a tab 1 and a bonding area in advance. Thus, a polyimide resin having good bondability to both is coated on the package resin and a lead frame having low affinity to effectively prevent a separation from occurring in the boundary between the tab 1 and the resin 7 due to a heating cycle applied to the package and a crack from occurring in the vicinity of the back surface of the tab 1.