| 摘要 |
The receptacle, especially enabling semiconductor microcomponents, and in particular laser diodes having approximately rectangular large faces, to be transported, comprises two reinforcing members 18, 20 connected together and emprisoning a grid 10. Circular holes 12 for receiving the microcomponents are made in the grid at regular intervals. The receptacle furthermore includes two closure plates 14, 16 each mounted in one of the reinforcing members and at least one of which can be moved with respect to the corresponding reinforcing member, and elastic means 24 for pressing the closure plates against the grid, each plate being conducting, at least over its surface facing the grid. <IMAGE>
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