发明名称 HEAT TREATING DEVICE
摘要 PURPOSE:To improve the uniformity of distribution in a wafer in the thickness of an oxidized film even when using an electric furnace with a soft landing mechanism by providing a fork supporting the wafer with a function as a cover. CONSTITUTION:In a fork 4 having an outer diameter of 12cm, cylinders 9,10 made of quartz, which have the same diameter as the fork and are 20cm long, are mounted before and behind a section to which a susceptor 2 is set. Both ends of the cylinders are closed, and holes 11,12 of 5mm.phi are bored for air vent. Regarding the cylinder 10, it is left in a core tube even under the state in which the fork is drawn out, and the working range of the fork is adjusted so that it functions as a throat cover.
申请公布号 JPS60194527(A) 申请公布日期 1985.10.03
申请号 JP19840049062 申请日期 1984.03.16
申请人 HITACHI SEISAKUSHO KK 发明人 TAMURA HIROSHI;YAGI KUNIHIRO;OZAWA MASAMI
分类号 H01L21/22;H01L21/205;H01L21/31;H01L21/324 主分类号 H01L21/22
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