| 摘要 |
PURPOSE:To obtain the titled device of high accuracy from lower resistances to higher resistances by a method wherein a chip resistor is loaded in series or parallel with a resistor formed out of a thin film on a ceramic substrate, and the thin film resistor is finely adjusted by being set close to the designed value with the chip resistor by laser trimming. CONSTITUTION:A resistor 2 and a conductor pattern 3 are formed on the ceramic substrate 1 out of a thin film. Next, the chip resistor 4 is loaded on the above-mentioned conductor pattern 3 with a conductive adhesive 5. Then, the thin film resistor 3 is trimmed by laser trimmer. Thereafter, the titled device is produced by loading other components and the like. |
