| 摘要 |
PURPOSE:To form a plurality of conductor patterns and metallic wires on the same substrate in small size and by the same process as other processes by forming and constituting a loop by the conductor patterns mutually shaped in parallel on the surface of the substrate and the metallic wires connecting sections among these conductor patterns through a wire bonding method. CONSTITUTION:Conductor patterns 2-1-2-5 are mutually formed in parallel on the surface of a substrate 1 with the insulating surface, and sections among end sections a, b are wire-bonded in the conductor patterns 2-1-2-5 and the conductor patterns are connected by metallic wires 3-1-3-4. Consequently, one loop is shaped by the metallic wires 3-1-3-4 among the conductor patterns 2-1-2-5, thus constituting inductance. 4 and 5 each represent patterns for external connection of the conductor patterns 2-1 and 2-5 at both ends. The inductance can be formed directly on the same plane of the same substrate, and can be miniaturized. |
