Hybrid circuit using a multilayer technique

摘要

In the case of this hybrid circuit which is to be used in the field of microelectronics, a metal substrate (2a, 6) with or without a thin insulation layer (2b, 7) is provided for hybrid mounting of discrete electronic components (1, 8). A plurality of plastic films (3, 4, 9, 10, 16) for accommodating conductor path networks and passive components both in discrete form and in thin-film technology are used as further levels of the multilayer device. As a result of the use of the metal substrate, which is optionally provided with the insulation layer, good heat dissipation of the heat losses occurring in the discrete electronic components is ensured, with good electrical insulation at the same time, while the plastic films which are provided with circuits make possible a high packing density. The metal substrate itself is preferably used as the base of a housing which surrounds the hybrid circuit.