发明名称 |
Process for the deposition of a metal from an electroless plating composition. |
摘要 |
<p>A metal is deposited onto a substrate from an electroless plating solution by plating an initial layer of metal onto the substrate, then contacting the metal-plated substrate with a solution of an acid; and plating an additional layer of metal onto the plated, acid-treated substrate. The process reduces the plating void defects.</p> |
申请公布号 |
EP0156167(A2) |
申请公布日期 |
1985.10.02 |
申请号 |
EP19850101922 |
申请日期 |
1985.02.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHEBINIAK, PAUL;KASCHAK, RONALD ANTHONY;ROOT, LOIS JEAN |
分类号 |
C23C18/16;C23C18/18;C23C18/52;H05K3/18;H05K3/22;(IPC1-7):C23C18/16 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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