| 摘要 |
Solar cells (12) in an array (10) are interconnected (26) by heating metal stripes (22), e.g. Cu, Al or Au, to cause them to spike through (26) the semiconductor layer (20), between the upper electrode (24) of one cell and the lower electrode (16) of the next adjacent cell. The stripes may be fabricated using a thick striped pattern material as a lift off mask, so that conductive material applied to the mask during deposition of the stripes, is removed with the mask ("paint and peel" method). Electrodes (24) may be isolated by laser scribing or by deposition using a "paint and peel" method, however it is not necessary for semiconductor layer (20) to be discontinuous between cells because of the low lateral conductivity of this layer. Semiconductor layer (20) may comprise a PIN structure, or I and N type regions and a Schottky barrier. <IMAGE> |
