| 发明名称 |
Conductive element metallized with a thick film silver composition |
| 摘要 |
A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 95% by weight silver and 5 to 35% by weight cadmium/antimony alloy dispersed in a liquid vehicle.
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| 申请公布号 |
US4544611(A) |
申请公布日期 |
1985.10.01 |
| 申请号 |
US19840604588 |
申请日期 |
1984.04.27 |
| 申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
RELLICK, JOSEPH R. |
| 分类号 |
C23C24/10;H01B1/02;H05K3/24;(IPC1-7):H01B1/02;H01B5/00 |
主分类号 |
C23C24/10 |
| 代理机构 |
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代理人 |
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