| 摘要 |
<p>UV AND THERMALLY CURABLE, THERMOPLASTIC-CONTAINING_ COMPOSITIONS A UV and thermally curable composition comprising (1) a member of the group consisting of (a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: < IMG > wherein R is M or CH3, R1 is an organic moiety and n is at least 2, (b) an epoxy resin containing at least 2 < IMG > groups, and (c) a mixture of (a) and (b); (2) a thermal initiator, (3) a photoinitiator, (41 a thermoplastic material, and (5) a non-polymerizable plasticizer for (4). The exposure of the composition to W radiation and heat in seriatim results in a cured solid product which can be utilized as adhesives, coatings, gaskets, sealants, resists and the like.</p> |
