| 摘要 |
PURPOSE:To prevent the generation of a crack or formation of a thin film of sealing resin on the surface of a transparent body when a semiconductor device is to be manufactured by a method wherein the transparent body is provided to the surface of a semiconductor element, and an annularly protruded part consisting of thermoplastic resin is formed at the peripheral edge part of the surface of the transparent body thereof. CONSTITUTION:A transparent body 6 having an annularly protruded part consisting of thermoplastic resin at the peripheral edge part of the surface is prepared at first. Such the transparent body 6 is adhered to the surface of a semiconductor element 1 according to transparent resin 5. Then the transparent body 6 thereof is pressed against the inside wall of a mold 7, the annularly protruded part is softened according to the temperature of the mold 7, and sealing resin is poured in the mold to be hardened in the condition making the annularly protruded part to be adhered closely to the inside wall of the mold 7. Then after hardening of the sealing resin is completed, when it is taken out from the mold 7, a resin package part 8 is formed in the condition exposing the surface of the transparent body. According to this construction, generation of a crack or damage on the surface of the transparent body 6 is checked. Moreover sealing resin is not adhered to the surface of the transparent body 6, and a posterior resin removal process becomes unnecessarily. |
