| 摘要 |
PURPOSE:To have an element and a protective circuit formed in one body to facilitate their sealing in the same container by a method wherein the protective circuit is formed on one side of one main surface of a silicon substrate, and a semiconductor laser element is fixed to the other side of said main surface using a fused metal through the intermediary of an insulating material. CONSTITUTION:A protective circuit 12 is formed in an integrated state on one side of one main surface of the silicon substrate 11 of a semiconductor laser device. Also, an insulating material 13 is buried on the other side of said main surface, and one electrode of a semiconductor laser element 1 is adhered to the insulating material 13 using a fused metal 14. Also, one electrode of the protective circuit 12 is connected to the metal 14, and the other electrode 15 is connected to the electrode of the element 1 using a wire 16. Then, the element 1 and the protective circuit 12 are formed in one body on the substrate 11 adhered to a conductive material 3, and a pole 4 and the electrode 15 of the protective circuit 12 are connected using a wire 5, thereby enabling to easily seal them in the same container. |
