| 摘要 |
PURPOSE:To enable to remove surely foreign matters in packages for semiconductor devices by a method wherein a mechanical impact is applied to the packages, the fine foreign matters in the packages are fallen off, sucked to a vacuum to be removed, and the packages are transferred with the front side out to the next process. CONSTITUTION:A rotary arm 7 is advanced, a supporting shaft 8 is placed at the position A, packages 1 are delivered with backside out from a loader part 3, and sucked to a vacuum onto a sucking surface 7a. The rotary arm 7 is retreated in succession, and the supporting shaft 8 is placed at the position B. Thereupon the rotary arm 7 is rotated as shown with an arrow mark C, the rotary arm 7 is made to collide with the upper part of an impact bearer 14 according to a rotating descent to be caused by empty weight to transmit the impact to the packages 1. Accordingly, particles of foreign matters inside of the packages 1 are fallen off, and sucked to a vacuum to be removed. Then the rotary arm 7 is rotated at 180 deg. as shown with an arrow mark E, and the sucked packages 1 are transferred with the front side out on the guide body 21 of a shooter part 20. Accordingly, the fine foreign matters in the packages 1 can be removed surely. |
