| 摘要 |
PURPOSE:To prevent a thermal transfer material from being fused to a thermal head at the time of printing, by providing a heat-resistant resin layer by applying a solution of a nitrogen-containing heat-resistant resin. CONSTITUTION:In a thermal transfer material comprising a thermal transfer layer on one side of a plastic film and a heat-resistant resin layer on the other side, the heat-resistant resin layer is provided by applying a solution of a nitrogen-containing heat-resistant resin. The nitrogen-containing resin has a linear structure containing nitrogen, and has a glass transition temperature of not lower than 150 deg.C, preferably, not lower than 200 deg.C. Examples of such a resin include polyimides, polyamide-imides, polyester imides, aramids, polybenzoimidazole and polyhydantoin, a particularly preferred example being a polyimide having high heat resistance. Accordingly, a thermal transfer material free of sticking phenomenon can be obtained, and the strength of a base film is further increased. |
