| 摘要 |
PURPOSE:To enable to exfoliate easily a loading parts without damaging a pattern on a substrate by a method wherein the difference of adhesions in a high temperature of an adhesive between the substrate and the loading parts, and an adhesive between the loading parts and an exfoliating tool is utilized. CONSTITUTION:An IC chip 12 is die bonded to be loaded according to resin paste 13 on a substrate 11. When the chip 12 is to be exfoliated, an adhesive 14 having the higher glass transition point than the paste 13 is applied on the chip 12 at first, and an exfoliating implement 15 is adhered thereon to be fixed. A wire 17 is made to pass through a hole 16 at the upper edge of the implement 15 thereof. Then, the wire 17 is operated in a high temperature to draw up upwards the implement 15, and the implement is exfoliated from the substrate 11 together with the chip 12. The reason why exfoliation is performed by performing heating is because that tensile shear stress of the paste 13 is reduced remarkably at the temperature thereof, and moreover remarkable heat softening is not generated yet to the adhesive 14, and the difference of tensile shearing forces between the paste 13 becomes maximum. |
