| 摘要 |
PURPOSE:To remove exposure of subpins from sealing resin, and to contrive to enhance humidity resistance of a resin sealed semiconductor device by a method wherein resin sealing is performed as to seal in resin completely the cut surfaces of the subpins supporting the island of a base ribbon. CONSTITUTION:After a semiconductor chip 1 is fixed on the island 2 of a base ribbon, between the electrodes of the chip 1 and the tip parts of leads 4 are connected by bonding wires 5, and the chip 1 and the island 2 are sealed with resin 7a together with the tip parts of the leads 4. Then subpins 3 supporting the island 2 to the outer frame 6 of the base ribbon are cut to be removed at the root part of the resin 7a. Then resin sealing for the second time is performed, the outside of the resin 7a is packed by resin 7b, and the cut surfaces of the pins 3 are packed up completely inside of the resin 7b at the same time. Because the cut surfaces of the pins 3 are covered completely by resin according to this manufacturing method, invasion of water from the exposed cut surfaces is removed, and humidity resistance is enhanced. |
