| 摘要 |
PURPOSE:To enable to pour molding resin uniformly in a cavity at manufacture of a semiconductor by a method wherein a resin injection hole is provided to a mold corresponding to the neighborhood of the center of the front part or the rear part of a package main body formation programming part on the upper side or the lower side of a lead frame. CONSTITUTION:A resin injection hole 21 is provided to a bottom tool 5 corresponding to the center of the front part of a package main body formation programing part on the lower side of a lead frame 7. Accordingly, molding resin advances uniformly toward the edge part on the opposite side from the gate 21 without leaning to the side on one side of the lead. Molding resin advances uniformly in a cavity 4 in such a way, a stable bed is provided, and disorder of the shape of bonding wires is not generated, too. Moreover, it is also favorable to provide the resin injection hole to a top tool corresponding to the center of the front part of the package main body formation programming part on the upper side of the lead frame 7. |
