ADHESIVE COMPOSITION

摘要

A heat-curable adhesive composition comprising a mixture of substantially solid particles of a first reactive component with separate substantially solid particles of at least a second reactive component, the first and second reactive components being capable of reacting together to effect curing when the composition is heated to the curing temperature and the particles having a size distributuion in which not more than 40% by weight of the particles are less than 50 micrometres in size and substantially all the particles are less than 300 micrometres in size. The specified particle size range is especially advantageous when the composition is to be used on a heat-shrinkable article to form a cured adhesive bond upon heat-shrinkage of the article about an object.