| 摘要 |
PURPOSE:To enhance the reliability in connecting works by a method wherein an insulating layer and a connecting conductive pad are formed on one inner lead, and other inner lead is electrically connected to a semiconductor chip using a bonding wire through the intermediary of a conductive pad, thereby enabling to change the arrangement of wirings. CONSTITUTION:Among a plurality of inner leads, at least a part of an inner lead 3 forms an insulating layer 7, a bonding wire connecting conductive pad 8 is formed on the insulating layer 7, and other inner leads 6 are electrically connected to a semiconductor chip 1 using bonding wires 4 and 5 through the conductive pad 7. As a result, the multi-level crossing of bonding wires when an IC package is assembled can be prevented, and the insulating function of the adjoining wirings can also be easily maintained. |
