| 摘要 |
PURPOSE:To prevent the substitution deposition of silver and to form a fine silver film when a substrate of a metal which is baser than silver is electroplated with silver, by pretreating the substrate with a soln. contg. a specified cyclic compound. CONSTITUTION:This pretreating soln. for silver plating is an aqueous soln. contg. a cyclic compound having a thioureilene group represented by the formula (where each of R1 and R2 is H, alkyl or aryl) in the ring. A substrate of a metal whcih is baser than silver such as a copper (alloy) substrate or a copper plated substrate is dipped in the pretreating soln. before the surface of the substrate is electroplated with silver. The substitution deposition of silver is prevented, and a fine silver film is formed by electroplating.
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