发明名称 |
PRETREATING SOLUTION FOR SILVER PLATING |
摘要 |
PURPOSE:To prevent the substitution deposition of silver and to form a fine silver film when a substrate of a metal which is baser than silver is electroplated with silver, by pretreating the substrate with a soln. contg. rhodanine. CONSTITUTION:This pretreating soln. for silver plating is an aqueous soln. contg. rhodanine. A substrate of a metal which is baser than silver such as a copper (alloy) substrate or a copper plated substrate is dipped in the pretreating soln. before the surface of the substrate is electroplated with silver. The substitution deposition of silver is prevented, and a fine silver film is formed by electroplating.
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申请公布号 |
JPS60190592(A) |
申请公布日期 |
1985.09.28 |
申请号 |
JP19840046593 |
申请日期 |
1984.03.13 |
申请人 |
NIPPON KOGYO KK |
发明人 |
OOKUBO RIICHI;MORI YASUO;KASAI SHIYUNICHI |
分类号 |
C25D5/36;C25D3/46;C25D5/34 |
主分类号 |
C25D5/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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