发明名称 PRETREATING SOLUTION FOR SILVER PLATING
摘要 PURPOSE:To prevent the substitution deposition of silver and to form a fine silver film when a substrate of a metal which is baser than silver is electroplated with silver, by pretreating the substrate with a soln. contg. rhodanine. CONSTITUTION:This pretreating soln. for silver plating is an aqueous soln. contg. rhodanine. A substrate of a metal which is baser than silver such as a copper (alloy) substrate or a copper plated substrate is dipped in the pretreating soln. before the surface of the substrate is electroplated with silver. The substitution deposition of silver is prevented, and a fine silver film is formed by electroplating.
申请公布号 JPS60190592(A) 申请公布日期 1985.09.28
申请号 JP19840046593 申请日期 1984.03.13
申请人 NIPPON KOGYO KK 发明人 OOKUBO RIICHI;MORI YASUO;KASAI SHIYUNICHI
分类号 C25D5/36;C25D3/46;C25D5/34 主分类号 C25D5/36
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