| 摘要 |
PURPOSE:To attain mass production of an IC card in manufacturing the IC card by using the IC card carrier which is composed of bonded IC modules on a sheet base material to which a terminal-inserting hole is provided, so that a connecting terminal will be inserted into the terminal-inserting hole. CONSTITUTION:An IC card carrier 1 is formed by bonding an IC module 3 to a sheet base material 2. A connecting terminal 5 of the module 3 is inserted into a terminal-inserting hole 4 of the sheet base material 2 and is exposed to the surface of the material 2. When an IC card carrier 1 stops at the required position, a frame 16 drops as if it were embracing the module 3 of the IC card carrier 1 and implants a resin solution comprising the card base body into a space 17 of the frame 16 from an implanting port. When the resin solution is of a thermoset resin solution type, the frame may be heated. When the solution is of a photosensitive or electron beam hardenable resin solution type, an ultraviolet ray or an electron beam may be irradiated on the resin solution. After hardening the solution in such a way, the IC card can be obtained by raising the frame 16 and punching it in the desired shape according to requirements. |
