发明名称 ROOM TEMPERATURE CURING ORGANOPOLYSILOXANE COMPOSITION
摘要 PURPOSE:To provide the titled composition curable easily by the moisture in air, having high storage stability, and free from corrosiveness, by compounding a specific organic silicon compound and a cure accelerator to an organopolysiloxane. CONSTITUTION:(A) 100pts.(wt.) of a diorganopolysiloxane of formula I (R is methyl, etc.; n is positive integer) and having a viscosity of 100-1,000,000cs at 20 deg.C wherein both molecular terminals of the compound are blocked with hydroxyl groups, is compounded with (B) 2-40pts., preferably 3-20pts. of an organic silicon compound of formula II (R<1>-R<4> are H or alkyl; R<5> is alkyl, etc.; R<6> is alkyl; a is 0 or 1) and (C) 0.01-10pts., preferably 0.1-3pts. of a cure accelerator, preferably an organic silicon compound containing the substituted guanidyl group of formula III (R<7> is 1-8C univalent hydrocarbon group).
申请公布号 JPS60190457(A) 申请公布日期 1985.09.27
申请号 JP19840047795 申请日期 1984.03.13
申请人 SHINETSU KAGAKU KOGYO KK 发明人 ARAI MASATOSHI;FUTATSUMORI KOUJI;INOUE TAKEO;SATOU SHINICHI
分类号 C08L83/06;C08K5/54;C08K5/544;C08L83/00;C08L83/04 主分类号 C08L83/06
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