| 摘要 |
PURPOSE:To form an apparatus in a small type by a method wherein an integrated circuit part constructed on a circuit substrate, and a capacitor connected between both the terminals of the electric power source of the integrated circuit and the earth are built in a package of one piece. CONSTITUTION:An IC12 is constructed by forming the integrated circuit on a circuit substrate 13, and electrode pads 131, 132,... are led out to leads 151, 152,... according to bonding fine wires 141, 142,.... A chip type capacitor 17 is connected between wiring patterns connected to the electric power source lead out lead 151 and the earthing lead 15N. The capacitor 17 is provided at a gap part in a package 11 or at the part to be filled up with a sealing member. A capacitor to be provided at the outside is made unnecessarily, the space factor is enhanced when the IC thereof is assembled in an apparatus, and formation of the apparatus in a small type, and simplification of assembling can be attained. |
