发明名称 MOLDING METHOD OF THERMOPLASTIC RESIN FILM
摘要 PURPOSE:To improve production rate of a film by bestowing uniform electrostatic adhesion on the whole of the film, by a method wherein an insulating layer is provided on the surface of a rotary cooling unit lying more outside than both the edges of the film and a spark to be generated on this part is controlled. CONSTITUTION:After an electrical insulating layer such as an aluminum oxide layer whose thickness is 150mum has been provided on both the end parts, whose length is 100mm. each, of a rotary cooling unit 2, the insulating layer is plated with chromium and mirror finish is applied to the layer. The rotary cooling unit 2 is so constituted that the edge part of a film 1 is put upon the insulating part of the rotary cooling unit 2 by a length of about 3mm. and the film 1 is taken off while DC voltage 64kV is being applied to a linear electrode 3 made of tungsten, whose diameter is 0.5mm., mounted at a distance of 5mm. from the rotary cooling unit. A spark is not generated between the linear electrode 3 and the rotary cooling unit 2, a reduction of electrostatic adhesion of the edge part of the film is controlled, the uniform electrostatic adhesion is obtained extending over the whole width of the film and a production rate of the film is improved drastically.
申请公布号 JPS60189417(A) 申请公布日期 1985.09.26
申请号 JP19840045273 申请日期 1984.03.09
申请人 DAIAFOIL KK 发明人 SAKAMOTO SEIJI;YANO AKIKAZU;SATOU YOSHIKI
分类号 B29C47/88;B29L7/00 主分类号 B29C47/88
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