发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To contrive to enhance the operating speed, and to enhance integration of a semiconductor integrated circuit device by a method wherein wirings between unit cells accommodating the functional circuits of various kinds are formed by using metal layers of at least two layers insulated mutually. CONSTITUTION:The output wiring of a unit cell 11a is led out to a channel region 121 according to a second layer aluminum wiring L1, and connected to the input gate electrode of a unit cell 11p through a contact 241, a first layer aluminum wiring L2, a contact 242 and a poly-silicon wiring L3. Moreover, a second layer aluminum wiring L4 connected to the first layer aluminum wiring L2 through a contact 243 is wired on a unit cell 11i interposing an insulating layer between them, and connected to the input gate electrode of a unit cell 11n through a contact 244, a first layer aluninum wiring L5, a contact 245, and a poly-silicon wiring L6. It is unnecessary to provide a through region between unit cells, and high integration can be attained.
申请公布号 JPS60189240(A) 申请公布日期 1985.09.26
申请号 JP19840044602 申请日期 1984.03.08
申请人 TOSHIBA KK 发明人 SUEDA AKIHIRO;KONDOU HITOSHI
分类号 H01L21/822;H01L21/3205;H01L21/82;H01L23/52;H01L23/522;H01L23/528;H01L27/04 主分类号 H01L21/822
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