| 摘要 |
PURPOSE:To enlarge rigidity of a lead frame, and to increase the number of semiconductor devices to be accommodated in the lead frame by elongating the lead frame by a method wherein the outside frame of the lead frame connecting the lead terminal groups of the semiconductor devices of the plural number of groups is bent nearly in parallel with the side thereof. CONSTITUTION:The outside frames on both the sides or on one side of a lead frame 1a is bent along the side to form an outside frame 4a. Because rigidity of the lead frame 1a to the direction of bending is enlarged, and largeness of bending is reduced, the lead frame can be formed in a long type. At execution of molding, when the lead frame 1a is clamped by putting on a bottom tool 9 using a guide pin 95 for positioning, the outside frame 4a is pressed flat, and molding can be attained. |
