| 摘要 |
PURPOSE:To lessen the power loss and to reduce the manhour in the assembling stage of the HIC by a method wherein the desired electrostatic capacity is constituted of a semiconductor substrate, an insulating film and an internal electrode, or, the desired electrostatic capacity is constituted by alternately stacking a first electrode and a second electrode on an insulating film. CONSTITUTION:A semiconductor chip 7 is die-bonded on one side 9 of metal members 9 and 10 for external electrode, the metal member 10 of the remnant other side and an upper electrode 11 provided on the semiconductor chip 7 are mutually connected with a fine metal wire 8 and the whole is sealed with a thermosetting resin 12 excluding the respective part of the metal members 9 and 10 for external electrode. In such this invention, miniature capacitor, the metal members 9 and 10 for external electrode, the fine metal wire 8 and the electrode 11 provided on the semiconductor chip 7 can be all made using materials having a small resistivity, such as gold, aluminum and so forth. |
