| 发明名称 |
METHOD OF PRODUCING ENCAPSULATED SEMICONDUCTOR COMPONENTS |
| 摘要 |
A method for producing semiconductor components in which a semiconductor chip (1) is covered with a permanently elastic material (3) and is encapsulated in a plastic (4) mixed with a filler, and in which the permanently elastic material (3) is provided with cavities (6). <IMAGE> |
| 申请公布号 |
EP0100837(A3) |
申请公布日期 |
1985.09.25 |
| 申请号 |
EP19830105789 |
申请日期 |
1983.06.13 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
RUCKER, DIETER, DR. DIPL.-ING. |
| 分类号 |
H01L21/56;H01L23/29;H01L23/31 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
