发明名称 COMPOSITE SHAPE MEMORY ALLOY
摘要 PURPOSE:To permit easy heat radiation during temp. drop and to improve responsiveness to shape restoration by coating a metallic layer having the heat conductivity larger than the heat conductivity of a shape memory alloy on at least part of the surface of the shape memory alloy base body. CONSTITUTION:Cu is thinly plated by electroless plating on at least part of the surface of a base body 1 consisting of an Ni-Ti alloy as a shape memory alloy. A plating layer 2 of Cu or Al having excellent heat conductivity and electrical conductivity is formed thereon by ordinary electroplating to form a composite shape memory alloy body together with the base body 1. The heat conduction from the junction point and supporting point of a large current relay using such composite shape memory alloy is made easy and fast response is obtd. without requiring a shunt circuit in the case of such relay.
申请公布号 JPS60187650(A) 申请公布日期 1985.09.25
申请号 JP19840041903 申请日期 1984.03.07
申请人 TOSHIBA KK 发明人 AISAKA TATSUYOSHI;KANBARA NAOTO
分类号 C22C19/03;B25J13/00 主分类号 C22C19/03
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