| 摘要 |
PURPOSE:To provide a wiring board which can firmly bond wiring patterns and has excellent heat resistance and reliability, by bonding a metallic foil to an insulating substrate through a specified adhesive layer and a second adhesive layer. CONSTITUTION:A first adhesive layer 2A composed of a butyral/phenol adhesive, etc. and a second adhesive layer 2B composed of a bisphenol A epoxy resin contg. a cyclic compd. having at least one double bond in the skeleton as a tackifier are applied to a metallic foil 3 in order. The foil is contact-bonded to an insulating substrate 1 at 180 deg.C at a rate of 5m/min by means of heated rolls 4, 5. A photoresist having the desired pattern is formed on the temporarily bonded foil 3 and selectively etched by wet etching to form the desired wiring pattern 3' which is then used as a mask. The adhesive layers 2A, 2B which are exposed by the removal of the foil by the above etching, are removed with toluene, etc. The substrate is then heat-treated at 130 deg.C for 3hr to cure the adhesives 2A, 2B, thus obtaining the desired wiring board. |
