发明名称 Resin composition and plated article thereof.
摘要 <p>Disclosed is a wet-platable acrylonitrile-butadiene-styrene resin (ABS resin) composition comprising 100 parts by weight of an ABS resin and 0.1 to 10 parts by weight of a compound represented by the following general formula [I]: &lt;Chemistry id="chema01" num="0001"&gt;&lt;Image id="ia01" he="24" wi="62" file="IMGA0001.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /&gt;&lt;/Chemistry&gt;wherein R&lt;Sub&gt;1&lt;/Sub&gt; stands for an alkyl group, R&lt;Sub&gt;2&lt;/Sub&gt; and R&lt;Sub&gt;3&lt;/Sub&gt; each stand for a hydrogen atom or a methyl group, R&lt;Sub&gt;4&lt;/Sub&gt; and R&lt;Sub&gt;5&lt;/Sub&gt; stand for a hydrogen atom or a group -C(O)R&lt;Sub&gt;B&lt;/Sub&gt; in which R&lt;Sub&gt;6&lt;/Sub&gt; stands for an alkyl group, and m and n are integers of from 1 to 20.</p><p>A plated resin article having an improved plating adhesion can be obtained by wet-plating a molded article formed from this ABS resin composition.</p>
申请公布号 EP0155604(A2) 申请公布日期 1985.09.25
申请号 EP19850102657 申请日期 1985.03.08
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 MAEDA, TETSURO DENKI KAGAKU KOGYO K.K.;ONAYA, KYOJI DENKI KAGAKU KOGYO K.K.;OKAMOTO, AKIHIRO DENKI KAGAKU KOGYO K.K.
分类号 C08L55/02;C08K5/17;(IPC1-7):C08L55/02 主分类号 C08L55/02
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