| 摘要 |
PURPOSE:A low-stress epoxy resin composition excellent in thermal shock cracking resistance, and useful for sealing semiconductor devices, containing, as a filler, a specified rubber-modified silica formed by coating silica with a synthetic rubber. CONSTITUTION:An epoxy resin composition containing, as at least part of a filler, rubber-modified silica formed by reacting silica with a silane coupling agent and a synthetic rubber having terminal reactive functional groups. Said silica means a crystalline silica or an amorphous silica, and for use in semiconductor sealing, it is desirable that the silica is low in a content of electrolytic impurities or foreign matter, it has an average particle diameter of 3-8mu and it contains no particle having a diameter >=100mu. The rubbers having terminal reactive functional groups include butadiene rubber, isoprene rubber, acrylonitrile rubber and their copolymers and modified products terminated with polymerizable functional groups such as vinyl, hydroxyl, carboxyl, and amino groups.
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