| 摘要 |
PURPOSE:To cool a semiconductor wafer excellently by fitting a cooling plate connected to a water-cooling pipe to the back of the wafer while previously mounting a path for a cooling gas to the back of the cooling plate when ion beams are injected to the surface of the semiconductor wafer. CONSTITUTION:When the surface 1a of a semiconductor wafer 1 being transported by a belt conveyor, etc. is treated through the injection of ion beams, etc., a detachable cooling plate 9 is fitted to the back 1b of the wafer 1, and the cooling plate 9 is ascended and descended freely by a shaft surrounded by a water-cooling pipe 10. A platen 2 through which the shaft is penetrated is positioned under the cooling plate 9, a partitioned space 6 is formed between the lower surface of the cooling plate 9 and the surface of th platen 2, and a cooling gas brought to several Torr is fed into the space 6 from suction and exhaust pipes 7 and 8 mounted to the lower section of the platen 2. The peripheral section of the wafer 1 is held down by clamps 4 projecting from the platen 2, and movement is prevented. Accordigly, the insufficient cooling of the cooling plate 9 is supplied by the cooling gas, and the cooling of the wafer 1 is improved. |
